* device mounted on ceramic pcb: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm 2 thru bzt52b39s 200 mw zener diode 4.3 to 39 volts features x planar die construction x 200mw power dissipation on ceramic pcb x general purpose medium current x ideally suited for automated assembly processes absolute maximum ratings symbol parameter rating unit p d power dissipation 200 mw t j junction temperature -65 to +175 : t stg storage temperature range -65 to +175 : absolute maximum ratings symbol parameter rating unit r thja thermal resistance junction to ambient* 305 : /w electrical characteristics symbol parameter rating unit v f maximum forward voltage (i f =10madc) 0.9 v bzt52b4v3s www. mccsemi .com revision: 2 2007/07/13 mcc
omp onents 20736 marilla street chatsworth
inches mm dim min m a x min ma x note a .090 .107 2.30 2.70 b .068 .078 1.75 1.95 c .045 .054 1.15 1.35 d .027 .038 0.70 0.95 e .009 .014 0.25 0.35 f .002 .006 0.05 0.15 g .012 --- 0.30 --- sod323 0.031? 0.059" 0.039? suggested solder pad layout a b e c d f g dimensions tm micro commercial components x case material: molded plastic. ul flammability classification rating 94v-0 1 of 3
www. mccsemi .com 2 of 3 mcc tm micro commercial components revision: 2 2007/07/13 bzt52b4v3s thru bzt52b39s electrical characteristics@25 c o min. nom. max. i zt (ma) max. i zk (ma) max. ua v bzt52b4v3s 4.21 4.3 4.39 5 90 1 600 3 1 -3.5 0 w7 bzt52b4v7s 4.61 4.7 4.79 5 80 1 500 3 2 -3.5 0.2 w8 bzt52b5v1s 5.0 5.1 5.2 5 60 1 480 2 2 -2.7 1.2 w9 bzt52b5v6s 5.49 5.6 5.71 5 40 1 400 1 2 -2 2.5 wa bzt52b6v2s 6.08 6.2 6.32 5 10 1 150 3 4 0.4 3.7 wb bzt52b6v8s 6.66 6.8 6.94 5 15 1 80 2 4 1.2 4.5 wc BZT52B7V5S 7.35 7.5 7.65 5 15 1 80 1 5 2.5 5.3 wd bzt52b8v2s 8.04 8.2 8.36 5 15 1 80 0.7 5 3.2 6.2 we bzt52b9v1s 8.92 9.1 9.28 5 15 1 100 0.5 6 3.8 7 wf bzt52b10s 9.8 10 10.2 5 20 1 150 0.2 7 4.5 8 wg bzt52b11s 10.78 11 11.22 5 20 1 150 0.1 8 5.4 9 wh bzt52b12s 11.76 12 12.24 5 25 1 150 0.1 8 6 10 wi bzt52b13s 12.74 13 13.3 5 30 1 170 0.1 8 7 11 wk bzt52b15s 14.7 15 15.3 5 30 1 200 0.1 10.5 9.2 13 wl bzt52b16s 15.68 16 16.3 5 40 1 200 0.1 11.2 10.4 14 wm bzt52b18s 17.6 18 18.4 5 45 1 225 0.1 12.6 12.4 16 wn bzt52b20s 19.6 20 20.4 5 55 1 225 0.1 14 14.4 18 wo bzt52b22s 21.56 22 22.44 5 55 1 250 0.1 15.4 16.4 20 wp bzt52b24s 23.52 24 24.5 5 70 1 250 0.1 16.8 18.4 22 wr bzt52b27s 26.46 27 27.54 2 80 0.5 300 0.1 18.9 21.4 25.3 ws bzt52b30s 29.4 30 30.6 2 80 0.5 300 0.1 21 24.4 29.4 wt bzt52b33s 32.34 33 33.7 2 80 0.5 325 0.1 23.1 27.4 33.4 wu bzt52b36s 35.28 36 36.72 2 90 0.5 350 0.1 25.2 30.4 37.4 ww bzt52b39s 38.22 39 39.8 2 130 0.5 350 0.1 27.3 33.4 41.2 wx (1) device mounted on ceramic pcb: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm 2 (2) f=1khz typical temperature coefficient @i ztc mv/ marking type zener voltage vz (1) volts maximum zener impedance (2) z zt (ohms) maximum zener impedance (2) z zk (ohms) reverse current i r (max)@v r
mcc revision: 2 2007/07/13 tm micro commercial components www. mccsemi .com 3 of 3 products are represented on our website, harmless against all damages. ***applications disclaimer*** ***important notice*** aerospace or military applications. products offer by micro commercial components corp . are not intended for use in medical, micro commercial components corp . reserve s the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . micro commercial components corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . the user of products in such applications shall assume all risks of such use and will agree to hold micro commercial components corp . and all the companies whose
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